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ESEC 2008SC3 Plus

Manufacturer: ESEC
Type: Die Bonder
Model: ESEC 2008SC3 Plus

Description: ESEC 2008SC3 Plus Smart Card Die Bonder

ESEC 2008SC3 Plus

SKU: ESEC 2008HS3plus SC

Quantity

Manufacturer: ESEC

Type: Die Bonder

Model: ESEC 2008SC3 Plus

Description: ESEC 2008SC3 Plus Smart Card Die Bonder
Ex-Works.
Smart card die attach, handle up to 300mm wafer.

Configuration of machine base on customer request.

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