Manufacturer: ESECType: Die BonderModel: ESEC 2008HS3 PlusDescription: ESEC 2008HS3 Plus Die BonderESEC 2008HS3 PlusSKU: ESEC 2008HS3 PlusBrandESECQuantityContact Us to PurchasePRODUCT INFO Manufacturer: ESEC Type: Die Bonder Model: ESEC 2008HS3 Plus Description: ESEC 2008HS3 Plus Die Bonder SHIPPING INFO Ex-Works. KEY FEATURES With wafer handling up to 300mm wafer. Configuration of machine base on customer request.